Runout and wobble measurement fixtures

ABSTRACT

A fixture is provided. The fixture includes a base, a turntable, a first sensor, and a second sensor. The turntable is supported on the base, is rotatable about a rotation axis, and is configured to slidably seat a susceptor assembly for rotation about the rotation axis. The first sensor is fixed relative to the base, is radially offset from the rotation axis, and is configured to determine ex-situ runout of the susceptor assembly. The second sensor is fixed relative to the first sensor, is axially offset from the first sensor, and is configured to determine ex-situ wobble of the susceptor assembly. Fixture arrangements and methods of determining ex-situ runout and ex-situ wobble of susceptor assemblies for semiconductor processing systems are also described.

CROSS-REFERENCE TO RELATED APPLICATIONS

This application is a non-provisional of, and claims priority to and thebenefit of, U.S. Provisional Patent Application No. 63/126,187, filedDec. 16, 2020 and entitled “RUNOUT AND WOBBLE MEASUREMENT FIXTURES,”which is hereby incorporated by reference herein.

FIELD OF INVENTION

The present disclosure generally relates to semiconductor processingsystems. More particularly, the present disclosure relates to makingsemiconductor processing systems, such as semiconductor processingsystems for depositing films onto substrates.

BACKGROUND OF THE DISCLOSURE

Semiconductor processing systems are commonly used to deposit films ontosubstrates, such as during the fabrication of very large-scaleintegrated circuits. Film deposition is generally accomplished is suchsemiconductor processing systems by supporting the substrate within areaction chamber and flowing a precursor gas through the reactionchamber and across the substrate. The reaction chamber typicallymaintains the substrate in an environment conducive for deposition of afilm onto the substrate while flowing the precursor gas across thesubstrate. The substrate is typically supported by a susceptor assembly,which seats the substrate on a shaft-driven susceptor, and which rotateswithin the reaction chamber as the precursor flows across the substrateto promote uniformity in the film deposited onto the substrate.

In some semiconductor processing devices, film uniformity may beinfluenced by runout and/or wobble of the susceptor assembly duringrotation relative to the surrounding reaction chamber structure. Forexample, excessive amounts of runout, i.e., radial displacement of apoint located at the periphery of the susceptor assembly during rotationrelative to surrounding reaction chamber structure, may, in somesemiconductor processing system, limit uniformity of a film depositedonto a substrate supported by a susceptor. Excessive amounts of wobble,i.e., axial displacement of a point located on the surface of thesusceptor assembly during rotation relative to surrounding reactionchamber structure, may, in some semiconductor processing, also limituniformity of a film deposited onto a substrate supported by thesusceptor assembly.

Runout and wobble may be controlled through piece part-levelmanufacturing tolerances and in-situ adjustment of the susceptorassembly during system-level installation and qualification. Piecepart-level manufacturing tolerances, for example, generally ensure thateach component selected for a particular susceptor assembly conforms tocertain predetermined manufacturing tolerances, thereby ensuring that nopiece-part will individually impart excessive runout and/or wobble intothe susceptor assembly once the susceptor assembled within the reactionchamber. In-situ qualification of the susceptor assembly once assembledwithin the reaction chamber typically allows runout and/or wobble of thesusceptor assembly to be adjusted to within predetermined limits.Susceptor assembly adjustments are generally able to limit runout and/orwobble where the tolerance stack-up of the piece-parts permitssuccessful adjustment of the assembled piece parts.

Such semiconductor processing systems and methods of makingsemiconductor processing systems have generally been suitable for theirintended purpose. However, there remains a need in the art for improvedfixtures, fixture arrangements, and methods of determining runout andwobble of susceptor assemblies for semiconductor processing systems. Thepresent disclosure provides a solution to this need.

SUMMARY OF THE DISCLOSURE

A fixture is provided. The fixture includes a base, a turntable, a firstsensor, and a second sensor. The turntable is supported on the base, isrotatable about a rotation axis, and is configured to slidably seat asusceptor assembly for rotation about the rotation axis. The firstsensor is fixed relative to the base, is radially offset from therotation axis, and is configured to determine ex-situ runout of thesusceptor assembly. The second sensor is fixed relative to the firstsensor, is axially offset from the first sensor, and is configured todetermine ex-situ wobble of the susceptor assembly.

In certain examples, the first sensor may be a first non-contact sensorand the second sensor may be a second non-contact sensor.

In certain examples, the first sensor may include a first laserdisplacement sensor and the second sensor may include a second laserdisplacement sensor.

In certain examples, at least one of the first laser displacement sensorand the second laser displacement sensor may have a spot size betweenabout 120 microns and about 1300 microns.

In certain examples, at least one of the first laser displacement sensorand the second laser displacement sensor may include (a) a visibleillumination source, (b) a red illumination source, or (c) a655-nanometer illumination source.

In certain examples, the fixture may include at least one handleextending laterally from the base and radially offset from the rotationaxis.

In certain examples, the fixture may include a pedestal fixed to thebase and radially offset from the rotation axis. One or more of thefirst sensor and the second sensor may be fixed to the pedestal.

In certain examples, the fixture may include a bracket fixing at leastone of the first sensor and the second sensor to the pedestal. Thebracket may define (a) a runout surface that is substantially orthogonalto the rotation axis or (b) a wobble surface that is substantiallyparallel to the rotation axis.

In certain examples, the pedestal may be a first pedestal fixing thefirst sensor to the base and the fixture may include a first bracket, asecond pedestal, and a second bracket. The first bracket may fix thefirst sensor to the first pedestal, may define a define a runout surfacethat is substantially orthogonal relative to the rotation axis, and maysupport thereon the first sensor. The second pedestal may be fixed tothe base, may be circumferentially offset from the first sensor aboutthe rotation axis, and may fix the second sensor to the base. The secondbracket may fix the second sensor to the second pedestal, may define awobble surface that is substantially parallel to the rotation axis, andmay support the second sensor on the wobble surface.

In certain examples, the turntable may include a lower member, anintermediate member, and an upper member. The lower member may be fixedto the base and have a bearing arrangement. The intermediate member maybe rotatably supported on the lower member by the bearing arrangementand may have a stop portion arranged along the rotation axis. The uppermember may be fixed to the intermediate member and may have a sleeveportion that extends about the rotation axis and axially from the shaftstop.

In certain examples, the turntable may include a first resilient memberand a second resilient member. The first resilient member may be seatedin the sleeve portion of the upper member, may extend about the rotationaxis, and may be axially offset from the lower member. The secondresilient member maybe seated in the sleeve portion, may extend aboutthe rotation axis, may be axially offset from the first resilientmember, and may be arranged along the rotation axis on a side of thefirst resilient member opposite the lower member.

In certain examples, the intermediate member may be (a) captive withinthe upper member of the turntable, or (b) captive between the lowermember and the upper member of the turntable.

In certain examples, a susceptor assembly may be slidably received inthe turntable and rotatable therein about the rotation axis relative tothe base.

In certain examples, the susceptor assembly may include a spider. Thespider may be arranged along the rotation axis. The spider may belocated axially between the second sensor and the turntable.

In certain examples, the susceptor assembly may include a susceptor. Thesusceptor may be arranged along the rotation axis. The susceptor may beaxially offset from the turntable. The susceptor may be radiallyoverlapped by the first sensor. The susceptor may be axially overlappedby the second sensor.

In certain examples, the susceptor assembly may include a shaft with alower end and an upper end. The lower end of the shaft may be slidablyreceived in the turntable. The upper end of the shaft may be arrangedbetween the second sensor and the turntable.

In certain examples, the fixture may include a controller. Thecontroller may be disposed in communication with the first sensor andthe second sensor. The controller may be disposed in communication witha non-transitory machine-readable memory. The controller may beresponsive to instructions recorded on the memory to receive a pluralityof radial displacement measurements of the susceptor assembly from thefirst sensor, receive a plurality of axial displacement measurements ofthe susceptor assembly from the second sensor, determine ex-situ runoutof the susceptor assembly using the plurality of radial displacementsreceived from the first sensor, and determine ex-situ wobble of thesusceptor assembly using the plurality of axial displacementmeasurements received from the second sensor.

A fixture arrangement is provided. The fixture arrangement includes afixture as described above and a susceptor assembly. The first sensor isa first non-contact sensor, the second sensor is a second non-contactsenor, the first sensor includes a first laser displacement sensor, andthe second sensor includes a second laser displacement sensor. Thesusceptor assembly is slidably seated in the turntable, is rotatabletherein about the rotation axis relative to the base, and includes ashaft, a spider, and a susceptor. The shaft has a lower end that isslidably received in the turntable and an upper end arranged between thesecond sensor and the turntable. The spider is arranged along therotation axis, is located axially between the second sensor and theturntable and is fixed to the upper end of the shaft. The susceptor isarranged along the rotation axis, is axially offset from the turntable,is fixed to the upper end of the shaft by the spider, is radiallyoverlapped by the first sensor, and is axially overlapped by the secondsensor.

A method of determining ex-situ runout and ex-situ wobble of a susceptorassembly for a semiconductor processing system is provided. The methodincludes, at a fixture as described above, slidably seating a susceptorassembly in the turntable for rotation about the rotation axis,determining ex-situ runout of the susceptor assembly using the firstsensor, and determining ex-situ wobble of the susceptor assembly usingthe second sensor. The ex-situ runout is compared to a predeterminedex-situ runout value and the susceptor assembly reworked when theex-situ runout exceeds the predetermined ex-situ runout value, theex-situ wobble is compared to a predetermined ex-situ wobble value andthe susceptor assembly reworked when the ex-situ wobble value exceedsthe predetermined ex-situ wobble value, and the susceptor assemblydisassembled when (a) the ex-situ runout is below the predeterminedex-situ runout value and (b) the ex-situ wobble is below thepredetermined ex-situ wobble value.

In certain examples, the method may include reassembling the susceptorassembly within a semiconductor processing device, determining in-siturunout of the susceptor assembly, and determining in-situ wobble of thesusceptor assembly. The in-situ runout may be compared to thepredetermined in-situ runout value and the susceptor assembly reworkedwhen the in-situ runout exceeds the predetermined in-situ runout value,the in-situ wobble may be compared to the predetermined in-situ wobblevalue and susceptor assembly reworked when the in-situ wobble valueexceeds the predetermined in-situ wobble value.

This summary is provided to introduce a selection of concepts in asimplified form. These concepts are described in further detail in thedetailed description of example embodiments of the disclosure below.This summary is not intended to identify key features or essentialfeatures of the claimed subject matter, nor is it intended to be used tolimit the scope of the claimed subject matter.

BRIEF DESCRIPTION OF THE DRAWING FIGURES

These and other features, aspects, and advantages of the inventiondisclosed herein are described below with reference to the drawings ofcertain embodiments, which are intended to illustrate and not to limitthe invention.

FIG. 1 is a schematic view of a fixture constructed in accordance withthe present disclosure, showing a susceptor assembly rotatably seated ina turntable with a first sensor and a second sensor for determiningin-situ runout and in-situ wobble of the susceptor assembly;

FIG. 2 is a schematic view of the fixture of FIG. 1, showing first andsecond sensor fixed relative to a frame and determining in-situ runoutand wobble of the susceptor assembly using radial and axial displacementmeasurements of the susceptor assembly;

FIG. 3 is a schematic view of the fixture of FIG. 1 according to anexample, showing a first pedestal supporting the first sensor and asecond pedestal supporting the second for determining ex-situ runout andex-situ wobble using the first sensor and the second sensor;

FIG. 4 is a schematic view of the fixture of FIG. 1 according to aanother example, showing a controller disposed in communication with thefirst sensor and the second sensor to calculate ex-situ runout andex-situ wobble of the susceptor assembly using radial and axialmeasurements received from the first sensor and the second sensor,respectively;

FIG. 5 is a cross-sectional side view of the turntable of the fixture ofFIG. 1 according to an example, showing an intermediate member with astop portion captive within an upper member and along the rotation axis;

FIG. 6 is a cross-sectional side view of the turntable of the fixture ofFIG. 1 according to another example, showing an intermediate member witha stop portion captive between an upper member and a lower member of theturntable and along the rotation axis;

FIG. 7 is a block diagram of a method of determining ex-situ runout andex-situ wobble of a susceptor assembly in accordance with the presentdisclosure, showing operations of the method according to anillustrative and non-limiting example of the method; and

FIG. 8 is a block diagram of a method of determining in-situ runout andin-situ wobble of a susceptor assembly in accordance with the presentdisclosure, showing operations of the method according to anotherillustrative and non-limiting example of the method.

It will be appreciated that elements in the figures are illustrated forsimplicity and clarity and have not necessarily been drawn to scale. Forexample, the dimensions of some of the elements in the figures may beexaggerated relative to other elements to help improve understanding ofillustrated embodiments of the present disclosure.

DETAILED DESCRIPTION OF EXEMPLARY EMBODIMENTS

Reference will now be made to the drawings wherein like referencenumerals identify similar structural features or aspects of the subjectdisclosure. For purposes of explanation and illustration, and notlimitation, a partial view of an example of a fixture in accordance withthe disclosure is shown in FIG. 1 and is designated generally byreference character 100. Other embodiments of fixtures, fixturearrangements, and methods of determining runout and wobble of susceptorassemblies for semiconductor processing systems in accordance with thepresent disclosure, or aspects thereof, are provided in FIGS. 2-8, aswill be described. The fixtures, fixture arrangements, and methods ofdetermining ex-situ runout and ex-situ wobble in susceptor assembliesfor assemblies can be used for making susceptor assemblies forsemiconductor processing systems, such as atmospheric chemical vapordeposition (CVD) systems used to deposit films using epitaxialtechniques, though the present disclosure is not limited to epitaxialtechniques or to CVD semiconductor processing systems in general.

Referring to FIG. 1, a fixture arrangement 102 including the fixture 100and a susceptor assembly 10 is shown. The susceptor assembly 10 includesa shaft 12, a spider 14, and a susceptor 16. The shaft 12 has a lowerend 18 and a longitudinally opposite upper end 20. The lower end 18 ofthe shaft 12 is slidably received within the fixture 100 and may have alocking groove 22 (shown in FIG. 4). The upper end 20 of the shaft 12has a spider seat 24 and fixedly seats thereon the spider 14. The spider14 is fixed in rotation relative to the shaft 12 and in turn seats thesusceptor 16. The susceptor 16 is in turn fixed in rotation relative tothe spider 14 and is configured to support a substrate 26 (shown in FIG.6) during deposition of a film 28 (shown in FIG. 6) onto the substrate26. It is contemplated that susceptor assembly 10 may be as shown anddescribed in U.S. Pat. No. 6,086,680 issued on Jul. 11, 2000, thecontents of which are incorporated herein by reference in its entirety.

As has been explained above, in some semiconductor processing systems,it can be desirable to limit in-situ runout and in-situ wobble of asusceptor assembly during the deposition of a film onto the substratesupported by a susceptor assembly, e.g., the in-situ runout 30 and/orthe in-situ wobble 32 during deposition of the film 28 onto thesubstrate 26 while supported by the susceptor assembly 10. Limitingin-situ runout and in-situ wobble is generally accomplished by adjustingand/or replacing parts of the susceptor assembly, e.g., by adjustingseating of the spider 14 on the spider seat 24 and/or seating of thesusceptor 16 on the spider 14, typically delaying qualification of thesemiconductor processing system into which the susceptor assembly hasbeen installed. As used herein the term “runout” refers to radialmovement of a point located on a radially outer periphery of thesusceptor assembly 10 during rotation about a rotation axis and relativeto the rotation axis. As used herein the term “wobble” refers to axialdisplacement of a point located on the susceptor assembly 10 duringrotation about the rotation axis and relative to the rotation axis.

Without being bound by a theory, applicant believes that the difficultyin making adjustments to a given susceptor assembly in-situ correspondsto manufacturing variation within the various piece parts selected forthe susceptor assembly. Specifically, while each of the selected pieceparts may individually conform to the tolerances governing each piecepart type, the tolerance stack-up of the piece arts within a specificsusceptor assembly may sometimes result in the susceptor assemblyexhibiting in-situ runout and/or in-situ wobble that exceeds apredetermined in-situ runout value and/or a predetermined in-situ wobblevalue. And while the in-situ runout and the in-situ wobble of thesusceptor assembly may generally successfully adjusted subsequent toassembly of the susceptor assembly within a semiconductor processingsystem, the need for such adjustments prolongs the installation and/orqualification of the semiconductor processing system into which thesusceptor assembly has been assembled. Therefore, to simplifyqualification of the semiconductor processing system, the fixture 100 isprovided.

With reference to FIG. 2, a fixture arrangement 102 including thefixture 100 and a susceptor assembly 10 is shown. The fixture 100includes a base 104, a turntable 106, a first sensor 108, and a secondsensor 110. The turntable 106 is supported on the base 104, is rotatableabout a rotation axis 112, and is configured to slidably seat thereinthe susceptor assembly 10 for rotation R relative to the base 104 aboutthe rotation axis 112. The first sensor 108 is fixed relative to thebase 104, is radially offset from the rotation axis 112, and isconfigured to determine ex-situ runout 38 of the susceptor assembly 10.The second sensor 110 is fixed relative to the base 104, is axiallyoffset from the first sensor 108 along the rotation axis 112 and isconfigured to determine ex-situ wobble 40 of the susceptor assembly 10.

One or more of the first sensor 108 and the second sensor 110 may be anon-contact sensor, e.g., an optical sensor. As will be appreciated bythose of skill in the art in view of the present disclosure, employmentof non-contact sensors limits (or eliminate) contamination of thesusceptor assembly 10 that may otherwise result from contact of a gaugeor measurement instrument with the susceptor assembly 10. As will alsobe appreciated by those of skill in the art in view of the presentdisclosure, non-contact sensors also limit (or eliminate) risk ofcontaminating the susceptor assembly 10 with particles, such as metallicparticles, during the determination of the ex-situ runout 38 and theex-situ wobble 40 of the susceptor assembly 10, limiting (oreliminating) the need to clean the susceptor assembly 10 subsequent todetermining the ex-situ runout 38 and the ex-situ wobble 40 of thesusceptor assembly 10.

One or more of the first sensor 108 and the second sensor 110 mayinclude a (a) a visible illumination source 114, (b) a red illuminationsource 116, or (c) a 655-nanometer illumination source 118. Employmentof such illumination sources simplifies determining the ex-situ runout38 and the ex-situ wobble 40 by allowing a user to visually confirm thatboth the first sensor 108 and the second sensor 110 remain opticallycoupled with the susceptor assembly 10 during rotation about therotation axis 112, simplifying techniques requirement measurement ofspot size on the surface of the susceptor assembly 10. Such illuminationsources may also be eye-safe, limiting risk of injury to the user duringthe determination of the ex-situ runout 38 and the wobble 32 of thesusceptor assembly 10.

One or more of the first sensor 108 and the second sensor 110 mayinclude a laser displacement sensor, e.g., a first laser displacementsensor 120 (shown in FIG. 3) and/or a second laser displacement sensor122 (shown in FIG. 2). In certain examples either (or both) the firstlaser displacement sensor 120 and/or the second laser displacementsensor 122 may have a spot size that is about 1200 microns in width,allowing determination of the runout 30 and/or wobble 32 without acomputer, simplifying employment of the fixture 100. Examples of suchlaser displacement sensors include IL-152 sensors, available from theKeyence Corporation of Itasca, Illinois.

In accordance with certain examples, either (or both) the first laserdisplacement sensor 120 and/or the second laser displacement sensor 122may have a spot size of about 120 microns. In such examples the firstlaser displacement sensor 120 and/or the second laser displacementsensor 122 may determine the ex-situ runout 38 and ex-situ wobble 40 ofthe susceptor assembly 10 in cooperation with a controller, e.g., acontroller 124 (shown in FIG. 4), allowing for automation of thedetermination of the ex-situ runout 38 and ex-situ wobble 40 of thesusceptor assembly 10. Examples of such laser displacement sensorsinclude HK-152 sensors, also available from the Keyence Corporation ofItasca, Illinois.

With reference to FIG. 3, the fixture 100 is shown according to anexample include a pedestal 126 and a bracket 128. The pedestal 126 isfixed to the base 104, is radially offset from the rotation axis 112,and at least one of the first sensor 108 and the second sensor 110 issupported by the pedestal 126. It is contemplated that the bracket 128fix at least one of the first sensor 108 and the second sensor 110 tothe pedestal 126. It is contemplated that the bracket 128 define arunout surface 130 or a wobble surface 132, the runout surface 130 beingsubstantially orthogonal relative to the rotation axis 112 and thewobble surface 132 being substantially parallel relative to the rotationaxis 112. As will be appreciated by those of skill in the art in view ofthe present disclosure, employment of the bracket 128 may simplify thesetup and/or maintenance of the fixture 100, e.g., by allowingqualification and/or certification of the fixture 100 through adjustmentof the runout surface 130 or the wobble surface 132.

In the illustrated example the pedestal 126 is a first pedestal 126, thebracket 128 is a first bracket 128, and the fixture 100 further includesa second pedestal 134 and a second bracket 136. The first pedestal 126is connected to the base 104, extends axially along the rotation axis112, and supports the first sensor 108. In this respect the firstbracket 128 is connected the first pedestal 126, is connected throughthe first pedestal 126 to the base 104 and defines the runout surface130. The runout surface 130 is planar, is orthogonal relative to therotation axis 112, and supports thereon the first sensor 108. It iscontemplated that the first sensor 108 be supported on the runoutsurface 130 such that the susceptor assembly 10 is in direct line ofsight with the first sensor 108, e.g., without an intervening structurebetween the first sensor 108 and the susceptor assembly 10. As will beappreciated by those of skill in the art in view of the presentdisclosure, the direct line of sight limits the output power requirementof the first sensor 108, simplifying determination of the ex-situ runout38 (shown in FIG. 1) of the susceptor assembly 10.

The second pedestal 134 pedestal 134 is similar to the first pedestal126, is additionally offset from the first pedestal 126 about therotation axis 112 and further has an axial height that is greater thanan axial height of the first pedestal 126. In this respect the secondpedestal 134 is connected to the base 104, extends axially along therotation axis 112, and supports the second sensor 110. The secondbracket 136 is connected to the second pedestal 134, is connectedthrough the second pedestal 134 to the base 104 and defines the wobblesurface 132. The wobble surface 132 is planar, extends in parallelrelative to the rotation axis 112, and supports thereon the secondsensor 110. It is contemplated that the second sensor 110 be supportedon the wobble surface 132 such that the susceptor assembly 10 is indirect line of sight with the second sensor 110, e.g., also without anyintervening structure between the second sensor 110 and the susceptorassembly 10. As will be also appreciated by those of skill in the art inview of the present disclosure, the direct line of sight limits theoutput power requirement of the second sensor 110, simplifyingdetermination of the wobble 32 (shown in FIG. 1) of the susceptorassembly 10.

With reference to FIG. 4, the fixture 100 is shown according an examplehaving the controller 124, a first handle 138, and a second handle 140.The first handle 138 extends laterally from the base 104 and at alocation radially offset from the rotation axis 112 and adjacent to thefirst pedestal 126. The second handle 140 is similar to the first handle138, is additionally offset from the first handle 138 about the rotationaxis 112, and further extends laterally from the base 104 at a locationradially offset from the rotation axis 112 and adjacent to the secondpedestal 134. Locating the first handle 138 adjacent to the firstpedestal 126 and the second handle 140 adjacent to the second pedestal134 simplifies handling of the fixture 100 as both the first handle 138and the second handle 140 are proximate the center of gravity of thefixture 100.

It is contemplated that the first handle 138 may be one of a firsthandle pair 142, the first handle pair 142 distributed on opposite sidesthe first pedestal 126 and radially offset from the rotation axis 112.It is also contemplated that the second handle 140 may be one of asecond handle pair 144, the second handle pair 144 distributed onopposite sides of the second pedestal 134 and radially offset from therotation axis 112. As will be appreciated by those of skill in the artin view of the present disclosure, the first handle 138, the secondhandle 140, the first handle pair 142, and/or the second handle pair 144allow the base 104 to be relative thick, which can limit the impact thatvibration in the ambient environment may have on determining the ex-siturunout 38 and the ex-situ wobble 40 of the susceptor assembly 10 usingthe fixture 100. The first handle pair 142 and the second handle pair144 also allow for lifting the fixture 100 from location proximate theturntable 106, which may require more than one individual to lift and/orshift the fixture 100.

With reference to FIG. 5, the turntable 106 is shown. The turntable 106includes a lower member 146, an intermediate member 148, and an uppermember 150. The lower member 146 includes a bearing arrangement 152 andis fixed relative to the base 104. The intermediate member 148 isrotatably supported on the lower member 146 by the bearing arrangement152 and has a stop portion 154, which is arranged along the rotationaxis 112 and is configured to receive thereon the lower end 18 of theshaft 12 (shown in FIG. 1). The upper member 150 is fixed in rotationrelative to the intermediate member 148, such as by one or morefastener, and has a sleeve portion 156. The sleeve portion 156 in turnextends about the rotation axis 112 and extends axially along therotation axis 112 from the stop portion 154 of the intermediate member148. In certain examples the turntable may have a crank for rotating thesusceptor assembly 10 about the rotation axis 112.

The turntable 106 also includes a first resilient member 158 and asecond resilient member 160. The first resilient member 158 is seated inthe sleeve portion 156 of the upper member 150 and extends about therotation axis 112. The first resilient member 158 is further axiallyoffset from the stop portion 154 of the intermediate member 148. Incertain examples, the first resilient member 158 may be an O-ring. Inaccordance with certain examples, the first resilient member 158 may beformed from an elastomeric material, such as rubber by way ofnon-limiting example.

The second resilient member 160 is seated in the sleeve portion 156 ofthe upper member 150 and extends about the rotation axis 112. The secondresilient member 160 is further axially separated from the stop portion154 of the intermediate member 148 by the first resilient member 158,and radially engages the locking groove 22 defined in the lower end 18of the shaft 12 (shown in FIG. 1) such that the susceptor assembly 10 isfixed in rotation relative to the upper member 150 of the turntable 106for coincident rotation therewith about the rotation axis 112. Incertain examples, the second resilient member 160 may be an O-ring. Inaccordance with certain examples, the second resilient member 160 may beformed from an elastomeric material, such as rubber by way ofnon-limiting example. It is also contemplated that, in accordance withcertain examples, that the second resilient member 160 may besubstantially identical with the first resilient member 158 prior toassembly in the turntable 106.

As shown in FIG. 5, the intermediate member 148 may be captive withinthe upper member 150 of the turntable 106. Captive arrangement of theintermediate member 148 allows the upper member 150 to seat directlyagainst the bearing arrangement 152, limiting the number of mechanicalinterfaces between the susceptor 16 (shown in FIG. 1) and limitingbacklash in arrangements where a drive module, e.g., a drive module 36,is operatively associate with the susceptor assembly 10.

With reference to FIG. 6, the turntable 106 is shown according toanother example wherein the intermediate member 148 is captive betweenthe upper member 150 and the lower member 146. In such examples theturntable 106 may be easier to fabricate, which can reduce cost intesting environments applications where higher levels of backlash areacceptable.

With continuing reference to FIG. 4, the controller 124 includes amemory 162, a processor 164, a device interface 166, and a userinterface 168. The device interface 166 operably connects the processor164 to the first sensor 108 and the second sensor 110, e.g., through awired or wireless link 170. The processor 164 is disposed incommunication with the memory 162 and is operably connected to the userinterface 168 to communicate the ex-situ runout 38 (shown in FIG. 2)and/or the ex-situ wobble 40 (shown in FIG. 2) of the susceptor assembly10 to a user. In certain examples, the memory 162 includes anon-transitory machine-readable medium having a plurality of programmodules 172 recorded thereon containing instruction that, when read bythe controller 124 cause the processer 164 to execute certainoperations. Among those operations are operations of a method 200 (shownin FIG. 7) of determining runout and wobble of a susceptor assembly.

In certain examples, the instructions recorded in the plurality ofprogram modules 172 may cause the processor 164 to (a) receive aplurality of radial displacement measurements 42 of the susceptorassembly 10 from the first sensor 108, and (b) receive a plurality ofaxial displacement measurements 44 of the susceptor assembly 10 from thesecond sensor 110. The instructions may further cause the controller 124to (c) determine the ex-situ runout 38 (shown in FIG. 2) of thesusceptor assembly 10 using the plurality of radial displacementmeasurements 42 received from the first sensor 108, and (d) determinethe ex-situ wobble 40 of the susceptor assembly 10 using the pluralityof axial displacement measurements 44 received from the second sensor110. In certain examples, the controller 124 may include a stand-alonecomputer or a handheld device including the memory 162, as suitable foran intended application.

With reference to FIG. 7, the method 200 of determining ex-situ runoutand ex-situ wobble of a susceptor assembly, e.g., the ex-situ runout 38(shown in FIG. 2) and the ex-situ wobble 40 (shown in FIG. 2) of thesusceptor assembly 10 (shown in FIG. 1), is shown. The method 200generally includes determining ex-situ runout and ex-situ wobble of thesusceptor assembly outside of a semiconductor processing system, e.g.,the semiconductor processing system 34 (shown in FIG. 1). As shown withbox 210, the susceptor assembly is slidably seated in a turntable forrotation about a rotation axis, e.g., the turntable 106 (shown in FIG.2) for rotation about the rotation axis 112 (shown in FIG. 2). As shownwith box 220, ex-situ runout of the susceptor assembly is determinedwhile slidably seated in the turntable of the fixture for rotation aboutthe rotation axis. As shown with box 240, ex-situ wobble of thesusceptor assembly is determined while slidably seated in the turntablefor rotation action about the rotation axis. In certain examples,ex-situ runout and ex-situ wobble may be determined coincident with oneanother, i.e. at the same time. As will be appreciated by those of skillin the art in view of the present disclosure, coincident determinationof ex-situ runout and ex-situ wobble limits noise otherwise associatedby acquiring the radial and axial displacement required for determiningex-situ runout and ex-situ wobble.

As shown with box 230, the ex-situ runout of the susceptor assembly iscompared to a predetermined ex-situ runout value. When the ex-siturunout is above the predetermined ex-situ runout value the susceptorassembly is reworked and rechecked, as shown with arrow 232, box 234,and arrow 236. When the ex-situ runout is below the predeterminedex-situ runout value the ex-situ wobble of the susceptor assembly isdetermined, as shown with arrow 238. In certain examples, the ex-siturunout may be determined using a first sensor, e.g., the first sensor108 (shown in FIG. 2). In accordance with certain examples, the ex-siturunout may be determined by calculating the ex-situ runout using aplurality of radial displacement measurements acquired from thesusceptor assembly during rotation about the rotation axis, e.g., theradial displacement measurements 42 (shown in FIG. 4). It iscontemplated that reworking the susceptor assembly may include adjustingseating of elements within the susceptor assembly. It is alsocontemplated that reworking the susceptor assembly may include alteringcontour of one or more seating surfaces within the susceptor assembly.

As shown with box 250, the ex-situ wobble of the susceptor assembly iscompared to a predetermined ex-situ wobble value. When the ex-situwobble is above the predetermined ex-situ wobble value the susceptorassembly is reworked and rechecked, as shown with arrow 252, box 254,and arrow 256. When (a) the ex-situ runout is below the predeterminedex-situ runout value and (b) the ex-situ wobble is below thepredetermined ex-situ wobble value, the susceptor assembly is removedfrom the fixture and disassembled for reassembly within a susceptorassembly, as shown with arrow 258, box 260, and box 270.

In certain examples, the ex-situ wobble may be determined using a secondsensor, e.g., the second sensor 110 (shown in FIG. 2). In accordancewith certain examples, the ex-situ wobble may be determined bycalculating the ex-situ wobble using a plurality of axial displacementmeasurements acquired during rotation of the susceptor assembly aboutthe rotation axis, e.g., the axial displacement measurements 44 (shownin FIG. 4). It is contemplated that reworking the susceptor assembly mayinclude adjusting seating of elements within the susceptor assembly. Itis also contemplated that reworking the susceptor assembly may includealtering contour of one or more seating surfaces within the susceptorassembly.

With reference to FIG. 8, the method 200 may also include determiningin-situ runout and in-situ wobble, i.e., subsequent to reassembly of thesusceptor within the semiconductor processing system, as shown with box280. The method may further include determining in-situ wobble of thesusceptor assembly, i.e., subsequent to reassembly of the susceptorassembly within the semiconductor processing system, as shown with box290.

As shown with box 282, in-situ runout of the susceptor assembly, e.g.,the in-situ runout 30 (shown in FIG. 1), is compared to a predeterminedin-situ runout value. When the in-situ runout value is above thepredetermined in-situ runout value the susceptor assembly is adjustedand rechecked, as shown with arrow 284, box 286, and arrow 288. When thein-situ runout is below the predetermined in-situ runout value, in-situwobble of the susceptor assembly is determined, as shown with box 290.In certain examples, the predetermined ex-situ runout value may beequivalent to the predetermined in-situ runout value.

As shown with box 292, in-situ wobble of the susceptor assembly, e.g.,the in-situ wobble 32 (shown in FIG. 1), is compared to a predeterminedin-situ wobble value. When the in-situ wobble value is above thepredetermined in-situ wobble value the susceptor assembly is adjustedand rechecked, as shown with arrow 294, box 296, and arrow 298. When thein-situ wobble is below the predetermined in-situ wobble value thesemiconductor processing system is qualified for production, as shownwith arrow 291 and box 293. Notably, as the susceptor assembly may bereworked to attend to excessive ex-situ runout and/or ex-situ wobblefound while seated in the fixture, e.g., by adjusting contour of thespider seat 24 (shown in FIG. 1), the likelihood that adjustment will berequired for excessive in-situ runout and/or in-situ wobble is reduced.In certain examples, the predetermined ex-situ wobble value may beequivalent to the predetermined in-situ wobble value.

The particular implementations shown and described are illustrative ofthe invention and its best mode and are not intended to otherwise limitthe scope of the aspects and implementations in any way. Indeed, for thesake of brevity, conventional manufacturing, connection, preparation,and other functional aspects of the system may not be described indetail. Furthermore, the connecting lines shown in the various figuresare intended to represent exemplary functional relationships and/orphysical couplings between the various elements. Many alternative oradditional functional relationship or physical connections may bepresent in the practical system, and/or may be absent in someembodiments.

It is to be understood that the configurations and/or approachesdescribed herein are exemplary in nature, and that these specificembodiments or examples are not to be considered in a limiting sense,because numerous variations are possible. The specific routines ormethods described herein may represent one or more of any number ofprocessing strategies. Thus, the various acts illustrated may beperformed in the sequence illustrated, in other sequences, or omitted insome cases.

The subject matter of the present disclosure includes all novel andnonobvious combinations and subcombinations of the various processes,systems, and configurations, and other features, functions, acts, and/orproperties disclosed herein, as well as any and all equivalents thereof.

Element List:

10 Susceptor Assembly

12 Shaft

14 Spider

16 Susceptor

18 Lower End (of Shaft)

20 Upper End (of Shaft)

22 Locking Groove

24 Spider Seat

26 Substrate

28 Film

30 In-Situ Runout

32 In-Situ Wobble

34 Semiconductor Processing System

36 Drive Module

38 Ex-Situ Runout

40 Ex-Situ Runout

42 Radial Displacement Measurements

44 Axial Displacement Measurements

100 Fixture

102 Fixture Arrangement

104 Base

106 Turntable

108 First Sensor

110 Second Sensor

112 Rotation Axis

114 Visible Illumination Source

116 Red Illumination Source

118 655-Nanometer Illumination Source

120 First Laser Displacement Sensor

122 Second Laser Displacement Sensor

124 Controller

126 First Pedestal

128 First Bracket

130 Runout Surface

132 Wobble Surface

134 Second Pedestal

136 Second Bracket

138 First Handle

140 Second Handle

142 First Handle Pair

144 Second Handle Pair

146 Lower Member

148 Intermediate Member

150 Upper Member

152 Bearing Arrangement

154 Stop Portion

156 Sleeve Portion

158 First Resilient Member

160 Second Resilient Member

162 Memory

164 Processor

166 Device Interface

168 User Interface

170 Link

172 Program Modules

200 Method

210 Box

220 Box

230 Box

232 Arrow

234 Box

236 Arrow

238 Arrow

240 Box

250 Box

252 Arrow

254 Box

256 Arrow

258 Arrow

260 Box

270 Box

280 Box

282 Box

284 Arrow

286 Box

288 Arrow

281 Arrow

290 Box

292 Box

294 Arrow

296 Box

298 Arrow

291 Arrow

293 Box

1. A fixture for determining runout and wobble in a susceptor assembly,comprising: a base; a turntable supported on the base and rotatableabout a rotation axis, the turntable configured to slidably seat thereinthe susceptor assembly for rotation about the rotation axis; a firstsensor fixed relative to the base and radially offset from the rotationaxis, the first sensor configured to determine ex-situ runout of thesusceptor assembly; and a second sensor fixed relative to the firstsensor and axially offset from the first sensor, the second sensorconfigured to determine ex-situ wobble of the susceptor assembly.
 2. Thefixture of claim 1, wherein the first sensor is a first non-contactsensor, wherein the second sensor is a second non-contact sensor.
 3. Thefixture of claim 1, wherein the first sensor comprises a first laserdisplacement sensor, wherein the second sensor comprises a second laserdisplacement sensor.
 4. The fixture of claim 3, wherein at least one ofthe first laser displacement sensor and the second laser displacementsensor has a spot size between about 120 microns and about 1300 microns.5. The fixture of claim 3, wherein at least one of the first laserdisplacement sensor and the second laser displacement sensor has (a) avisible illumination source, (b) a red illumination source, or (c) a655-nanometer illumination source.
 6. The fixture of claim 1, furthercomprising at least one handle extending laterally from the base andradially offset from the rotation axis.
 7. The fixture of claim 1,further comprising a pedestal fixed to the base and radially offset fromthe rotation axis, at least one of the first sensor and the secondsensor fixed to the pedestal.
 8. The fixture of claim 7, furthercomprising a bracket fixing at least one of the first sensor and thesecond sensor to the pedestal, the bracket (a) defining a runout surfaceorthogonal to the rotation axis, or (b) defining a wobble surfaceparallel to the rotation axis.
 9. The fixture of claim 7, wherein thepedestal is a first pedestal fixing the first sensor to the base, thefixture further comprising: a first bracket fixing the first sensor tothe first pedestal, the first bracket having a runout surface supportingthe first sensor and orthogonal to the rotation axis; a second pedestalfixed to the base and circumferentially offset from the first sensorabout the rotation axis, the second pedestal fixing the second sensor tothe base; and a second bracket fixing the second sensor to the secondpedestal, the second bracket defining a wobble surface parallel to therotation axis, the second sensor supported on the wobble surface. 10.The fixture of claim 1, wherein the turntable comprises: a lower memberwith a bearing arrangement fixed to the base; an intermediate memberrotatably supported on the lower member by the bearing arrangement andhaving a stop portion, the stop portion arranged along the rotationaxis; and an upper member fixed to the intermediate member with a sleeveportion, the sleeve portion extending about the rotation axis andextending axially from the stop portion of the intermediate member. 11.The fixture of claim 10, wherein the turntable further comprises: afirst resilient member seated in the sleeve portion of the upper memberand extending about the rotation axis, the first resilient memberaxially offset from the lower member; and a second resilient memberseated in the sleeve portion of the upper member and extending about therotation axis, the second resilient member axially offset from the firstresilient member along the rotation axis and on a side of the firstresilient member opposite the lower member.
 12. The fixture of claim 10,wherein the intermediate member is captive within the upper member orcaptive between the lower member and the upper member of the turntable.13. The fixture of claim 1, further comprising a susceptor assemblyslidably received in the turntable and rotatable therein about therotation axis relative to the base.
 14. The fixture of claim 13, whereinthe susceptor assembly comprises a spider arranged along the rotationaxis and located axially between the second sensor and the turntable.15. The fixture of claim 13, wherein the susceptor assembly comprises asusceptor arranged along the rotation axis and axially offset from theturntable, the susceptor radially overlapped by the first sensor, thesusceptor axially overlapped by the second sensor.
 16. The fixture ofclaim 13, wherein the susceptor assembly comprises a shaft with a lowerend and an upper end, the lower end of the shaft slidably received inthe turntable, the upper end of the shaft arranged between the secondsensor and the turntable.
 17. The fixture of claim 13, furthercomprising a controller disposed in communication with the first sensorand the second sensor, the controller further disposed in communicationwith a non-transitory machine-readable memory to: receive a plurality ofradial displacement measurements of the susceptor assembly from thefirst sensor; receive a plurality of axial displacement measurements ofthe susceptor assembly from the second sensor; determine ex-situ runoutof the susceptor assembly using the plurality of radial displacementsreceived from the first sensor; and determine ex-situ wobble of thesusceptor assembly using the plurality of axial displacementmeasurements received from the second sensor.
 18. A fixture arrangementfor determining runout and wobble of a susceptor assembly, comprising: afixture as recited in claim 1, wherein the first sensor is a firstnon-contact sensor, wherein the second sensor is a second non-contactsensor, wherein the first sensor comprises a first laser displacementsensor, wherein the second sensor comprises a second laser displacementsensor; and a susceptor assembly slidably seated in the turntable androtatable therein about the rotation axis relative to the base, thesusceptor assembly comprising: a shaft with a lower end and an upperend, the lower end of the shaft slidably received in the turntable, theupper end of the shaft arranged between the second sensor and theturntable; a spider arranged along the rotation axis and located axiallybetween the second sensor and the turntable, the spider fixed to theupper end of the shaft; and a susceptor arranged along the rotation axisand axially offset from the turntable, the susceptor fixed to the upperend of the shaft by the spider, the susceptor radially overlapped by thefirst sensor, and the susceptor axially overlapped by the second sensor.19. A method of determining ex-situ runout and ex-situ wobble of asusceptor assembly, comprising: at a fixture including a base, aturntable supported on the base and rotatable about a rotation axis, afirst sensor fixed relative to the base and radially offset from therotation axis, and a second sensor fixed relative to the first sensorand axially offset from the first sensor, slidably seating a susceptorassembly in the turntable for rotation about the rotation axis;determining ex-situ runout of the susceptor assembly using the firstsensor; determining ex-situ wobble of the susceptor assembly using thesecond sensor; comparing the ex-situ runout to a predetermined ex-siturunout value and reworking the susceptor assembly when the ex-siturunout exceeds the predetermined ex-situ runout value; comparing theex-situ wobble to a predetermined ex-situ wobble value and reworking thesusceptor assembly when the ex-situ wobble value exceeds thepredetermined ex-situ wobble value; and disassembling the susceptorassembly when (a) the ex-situ runout is below the predetermined ex-siturunout value, and (b) the ex-situ wobble is below the predeterminedex-situ wobble value.
 20. The method of claim 19, further comprising:reassembling the susceptor assembly within a semiconductor processingdevice; and determining in-situ runout of the susceptor assembly;determining in-situ wobble of the susceptor assembly; comparing thein-situ runout to a predetermined in-situ runout value and adjusting thesusceptor assembly when the in-situ runout exceeds the predeterminedin-situ runout value; and comparing the in-situ wobble to apredetermined in-situ wobble value and adjusting the susceptor assemblywhen the in-situ wobble exceeds the predetermined in-situ wobble value.